IMPROVED CORROSION-RESISTANCE OF PULSE PLATED NICKEL THROUGH CRYSTALLIZATION CONTROL

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Author list: TANG PT, WATANABE T, ANDERSEN JET, BECHNIELSEN G

Publisher: Springer

Place: LONDON

Publication year: 1995

Journal: Journal of Applied Electrochemistry (0021-891X)

Journal acronym: J APPL ELECTROCHEM

Volume number: 25

Issue number: 4

Start page: 347

End page: 352

Number of pages: 6

ISSN: 0021-891X

eISSN: 1572-8838

Languages: English-Great Britain (EN-GB)

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Abstract

When electrodeposition of nickel is used for corrosion protection of steel two aspects are important: the porosity of the coating and the resistance against corrosion provided by the coating itself, Using simple pulsed current (PC) plating, the size of the deposited crystals can be significantly smaller, thereby reducing porosity correspondingly. This usually also leads to improved hardness of the coating, Introducing pulse reversal (PR) plating, the most active crystals are continuously dissolved during the anodic pulse, providing a coating with improved subsequent corrosion resistance in almost any corrosive environment, This correlation between film texture and corrosion resistance will be discussed.

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