PULSE PLATING ON GOLD SURFACES STUDIED BY IN-SITU SCANNING-TUNNELING-MICROSCOPY

Conference proceedings article

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Publication Details

Author list: ANDERSEN JET, BECHNIELSEN G, MOLLER P

Publisher: Elsevier

Place: LAUSANNE 1

Publication year: 1994

Journal: Surface and Coatings Technology (0257-8972)

Journal acronym: SURF COAT TECH

Volume number: 67

Issue number: 3

Start page: 151

End page: 159

Number of pages: 9

ISSN: 0257-8972

eISSN: 1879-3347

Languages: English-Great Britain (EN-GB)

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Abstract

Deposition of bulk copper on thin film gold surfaces is carried out by computer-aided pulse plating. It is demonstrated that the morphology of the copper deposit can be studied by in situ scanning tunnelling microscopy both in potentiostatic experiments and in galvanostatic experiments. Optimized procedures for obtaining smooth deposits by pulse plating are explained in terms of a levelling effect. Possible non-faradaic processes observed in measurements with high frequency pulse plating are discussed.

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