DISSOLUTION OF BASE METALS FROM WPCBs USING Na2S2O8 SOLUTION

Journal article

Authors/Editors

Agachi, Paul

Research Areas

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Publication Details

Author list: Fogarasi S, Imre-Lucaci F, Ilea P, Agachi PS, Imre-Lucaci A

Publisher: UNIV ATHENS FIRST DEPT OBSTETR

Place: CLUJ-NAPOCA

Publication year: 2015

Journal acronym: STUD U BABES-BOL CHE

Volume number: 60

Issue number: 3

Start page: 205

End page: 214

Number of pages: 10

ISSN: 1224-7154

Languages: English-Great Britain (EN-GB)

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Abstract

The present work aimed to evaluate the performances of Cu, Zn and Ni dissolution from Waste printed circuit boards (WPCBs) obtained from mobile phones (MP) using different solid: liquid ratios (SLR) and oxidant concentration (C-ox). It was found that the increase of C-ox at constant SLR increases more the performances of Zn and Ni dissolution than it does for Cu. In contrast, the increase of SLR from 1: 5 to 1: 15 at constant C-ox diminished the dissolution efficiency of Ni by 79 %, of Zn with 55 % and in the case Cu by 22 %. The experimental results revealed that the most favorable conditions for the dissolution of Zn, Ni and Cu are provided at the SLR of 1: 5 and 0.42 M Na2S2O8.

Keywords

base metals, Leaching, persulfate, solid:liquid ratio, WPCBs

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